Speaker : Stephan Scholze Abstract: Optimisation Topics in Die Attach The semiconductor market is a high volume market. For example, the market volume for cellular phones in the year 2004 is expected to reach about 600 Million units. But before consumer electronic devices can be produced, the semiconductor chips have to be packaged into a protective housing. An entire industry is working in the chip packaging field. In the first part of this talk, a brief overview of the main chip packaging steps is given. Especially, we will concentrate on 'die attach' by introducing its main process steps: dispensing, picking and bonding. The goals, challenges and limitations of each of these process steps are introduced as well. Next, we will turn our attention to the optimisation of this process. After formulating our optimisation objectives, an example for a practical optimisation task is discussed. This example is also used to pinpoint the various parameters and influences, which affect the process quality and speed.